Development and construction of new high-bandwidth memory (HBM) advanced packaging facility in Singapore
Advising Micron Semiconductor Asia Operations Pte Ltd on the first and second phases of the development and construction of a High-Bandwidth Memory (HBM) advanced packaging facility (the first of its kind in Singapore), including advising on the bidding process, drafting, advising on and negotiating various project agreements (including concept design agreement, LEW consultancy services agreements, early permitting services agreement, equipment purchase agreements for all long lead equipment, land lease agreement, substation contract and engineering, procurement and construction contracts). The indicative project cost for the development is S$9.5billion (approximately RM31.2 billion).
Advising Micron Semiconductor Asia Operations Pte. Ltd. are
Partner Dzuhairi Jaafar Thani and Principal Tee Zhi Lun.
